KVR32S22D8/32

32GB 2Rx8 4G x 64-Bit PC4-3200 CL22 260-Pin SODIMM


DESCRIPTION

This document describes ValueRAM’s KVR32S22D8/32 is a 4G x 64-bit (32GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 2Rx8, non-ECC, memory module, based on sixteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. This 260-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:

FEATURES

  • Power Supply: VDD = 1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP = 2.5V Typical
  • VDDSPD = 2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.18” (30.00mm)
  • RoHS Compliant and Halogen-Free

SPECIFICATIONS

CL(IDD) 22 cycles
Row Cycle Time (tRCmin) 45.75ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin) 350ns (min.)
Row Active Time (tRASmin) 32ns (min.)
UL Rating 94 V – 0
Operating Temperature 0°C to +85°C
Storage Temperature -55°C to +100°C

3,400 EGP

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Description

KVR32S22D8/32

32GB 2Rx8 4G x 64-Bit PC4-3200 CL22 260-Pin SODIMM


DESCRIPTION

This document describes ValueRAM’s KVR32S22D8/32 is a 4G x 64-bit (32GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 2Rx8, non-ECC, memory module, based on sixteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. This 260-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:

FEATURES

  • Power Supply: VDD = 1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP = 2.5V Typical
  • VDDSPD = 2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.18” (30.00mm)
  • RoHS Compliant and Halogen-Free

SPECIFICATIONS

CL(IDD) 22 cycles
Row Cycle Time (tRCmin) 45.75ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin) 350ns (min.)
Row Active Time (tRASmin) 32ns (min.)
UL Rating 94 V – 0
Operating Temperature 0°C to +85°C
Storage Temperature -55°C to +100°C